手動平行光曝光機

PCB內外層曝光製程
The exposure process for PCB inner/outer layer

Item/項目	Specification/技術規格
機台尺寸/重量 Dimensions/Weight	長(D)x寬(W)x高(H): 1260mm x 3150mm x 2100mm 重量(Weight)：~1100kg
電源 Power	3相4線 (3P4W), 50/60HZ, 380V/220V, 14KVA, 40A
光源系統 Lamp System	燈源(Lamp): 5kw短弧汞氙燈/ 5KW Mercury Metal Short Arc Lamp 檯面均勻度(Uniformity): ≧85% 光強度(Intensity): 13 mW/cm² 線路解析度(Resolution): (Line/Space) 3/3㏕燈源冷卻(Lamp Cooing): 強制風冷(air cooling) 光偏角(Declination Angle): ≦3°
曝光系統 Exposure System	曝光面積(Exposure area): 560mm x 600mm 檯面冷卻(Exposure Cooling): 冷氣強制風冷(Cooled air cooling) 曝光檯面(Exposure Frame): 雙框(玻璃 – 麥拉)/ 2 sets of frame (Glass - Mylar)
基版尺寸 Suitable Panel Size	板材厚度(Thickness): 0.1mm~3.2mm 板彎板翹(Bow and twist): ≦1mm 板厚誤差(Thickness tolerance): ≦3.2mil
外部供應 Utilities	冷卻水需求(Cooling water): 2.5~3.0kg, 5~10℃, 60L/min, 管徑: Ø1.5” 氣壓源(Air supply): 5~8kg/cm²
環境要求 Clean room	無塵室潔淨度(Clean room CLASS): ≦10000級溫度(room Temperature): 22℃±2℃, 濕度(Humidity): 55%±5%RH